***********************************************************************
***********           PANJIT International Inc.             ***********
***********************************************************************
*June 12, 2025                                                         *
*                                                                     *
*This SPICE Model describes the characteristics of a typical device   *
*and does not respresent the specification. Designer should refer to  *
*the same type name data sheet for specification limits.              *
***********************************************************************
*$
.subckt 3P0SMCJ33A  A K 
.param
+vc0 = 1.846e-10	      vc1 = 4.816e-11		vc2 = 1.000		vc3 = 5.213e-12		vc4 = 2.055e-1
+tc1 = 9.608e-2		      tc2 = 3.345e-2		tc3 = 1.008e-2		tc4 = 3.895e-2	
.func irexp(v) {(vc0+vc1*v**vc2)*(1.0+tc1*(temp-25)*exp(tc2*(temp-25)))+(vc3*exp(vc4*v))*(1.0+tc3*(temp-25)*exp(tc4*(temp-25)))}
.func rbv(i) {1.141e-1*min(i,0)}
d1  A A1 zener
g1 A1 A value = {irexp(v(A1,A))}
v1 A1 K1 0
e1 K1 K value = {rbv(i(v1))}
.model zener d
***** flag parameter *****
+level = 1 
***** dc model parameter *****
+ is = 6.416e-13	        n = 1.077               rs = 5.756e-3
+ibv = 1.0e-3	              nbv = 1.000	        bv = 39.45
+ikf = 9.174e-1
***** capacitance parameter *****
+cjo = 3.888e-9	                m = 3.348e-1		vj = 5.868e-1
+ fc = 0.5
***** temperature coefficient *****
+tnom = 25		       eg = 1.120	       xti = 3
+trs1 = 2.340e-3             tikf = 2.555e-3       
+tbv1 = 9.130e-4	     tbv2 = -3.239e-7
.ends 3P0SMCJ33A
*$
